SummaryDuring a study of addition agents for acid copper sulphate solution, it has been shown that benzotriazole forms an insoluble cuprous complex which codeposits with the copper.1a A method has been devised for dissolving the deposit and separating the addition agent and it has been demonstrated that benzotriazole can be recovered from the electrodeposit in the undecomposed form.2 Since benzotriazole can be separated and estimated with accuracy, it provides a compound which is eminently suitable for studying addition agent action during electrodeposition. Polarization studies have shown that benzotriazole markedly increases the activation overpotential of the cathode ηA—mainly by decreasing the active area of the surface by film formation—and it is possible to detect 10−7 M benzotriazole from its effect on the cathode overpotential. Additions of 0·012 g/l benzotriazole give very fine grained deposits of copper and prevent epitaxy, while higher concentrations (0·12 g/1) result in fully-bright deposits with a banded structure. The effect of plating variables on the amount of benzotriazole included in copper deposits has been studied as a necessary prerequisite for suggesting a mechanism of addition agent action which, in this particular system, has been based on the formation of metal complexes.
No takes yet. Share an insight, caveat, or question.
Prall et al. (1964) studied this question.
Synapse has enriched 5 related papers. Consider them for comparative context: