ABSTRACT This study presents a bio‐inspired growth algorithm for enhancing conductive cooling in electronic systems through the strategic distribution of high‐conductivity material within a rectangular domain. The proposed methodology is inspired by adaptive branching mechanisms observed in natural transport systems, such as tree roots and vascular networks, where growth preferentially occurs toward regions with higher resource demand. Analogously, conductive branches evolve toward thermal hot spots to improve heat spreading and reduce thermal resistance. The growth process is constrained by a prescribed volume fraction of high‐conductivity material and is applicable to both uniform and non‐uniform heat generation as well as symmetric and asymmetric thermal boundary conditions. The influence of key design parameters, including conductive volume fraction, aspect ratio, growth step length, and heat‐sink location, is systematically investigated. In addition to thermal performance, the effect of temperature reduction on component reliability is evaluated using the Arrhenius lifetime model. The results show that the proposed approach reduces the maximum temperature by 25% compared with the plain case, leading to a corresponding increase in predicted lifetime of up to 612%. The algorithm automatically generates efficient conductive networks according to the imposed thermal conditions without requiring predefined geometric templates or symmetry assumptions. These findings demonstrate the potential of the proposed growth‐based design methodology as a flexible framework for thermal management and reliability enhancement of electronic devices operating under complex and non‐ideal thermal conditions.
Arbaban et al. (Sun,) studied this question.
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