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With the continuous integration and miniaturization of electronic devices, the heat transfer of the electronic devices continues to surge. This means that thermal management equipment with higher heat flux cooling capacity is required to maintain its normal operation. This paper systematically reviews the progress of spray cooling. In the first part, the thermal dissipation mechanism of spray cooling in the non-boiling regime and boiling regime are summarized, and the correlation formula of heat transfer is summarized. In the second part, the influencing factors of various parameters of the nozzle are summarized, the experimental research and numerical simulation research are summarized separately, and some means and methods to strengthen heat transfer are listed. In the third part, we summarize the current application research of spray cooling in some hot new fields, including electronic technology, aerospace, biomedicine, battery safety, etc. The research prospects and challenges in these fields are highlighted. This research provides a timely and necessary study of spray cooling.
Zhang et al. (Mon,) studied this question.