The dissolution of copper from waste printed circuit boards in chloride media using hydrogen peroxide as oxidant was carried out. The effects of stirring speed, temperature, solid/liquid ratio and concentrations of HCl and H 2 O 2 on the leaching of copper were investigated. The copper extraction increased significantly with the increase of HCl concentration. H + and Cl − ions both improved the leaching of copper from waste printed circuit boards and had the synergetic effect on copper dissolution. The H 2 O 2 was the main reagent which made possible the leaching of metallic copper from waste printed circuit boards in acidic chloride solutions. The copper extraction also increased with the increase of stirring speed, temperature and solid/liquid ratio. Finally, a reaction mechanism was proposed as well.
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Wang et al. (2016) studied this question.
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