Ultrahigh Flux Thin Film Boiling Heat Transfer Through Nanoporous Membranes

Phase change heat transfer is fundamentally important for thermal energy conversion and management, such as in electronics with power density over 1 kW/cm2. The critical heat flux (CHF) of phase change heat transfer, either evaporation or boiling, is limited by vapor flux from the liquid–vapor interface, known as the upper limit of heat flux. This limit could in theory be greater than 1 kW/cm2 on a planar surface, but its experimental realization has remained elusive. Here, we utilized nanoporous membranes to realize a new “thin film boiling” regime that resulted in an unprecedentedly high CHF of over 1.2 kW/cm2 on a planar surface, which is within a factor of 4 of the theoretical limit, and can be increased to a higher value if mechanical strength of the membranes can be improved (demonstrated with 1.85 kW/cm2 CHF in this work). The liquid supply is achieved through a simple nanoporous membrane that supports the liquid film where its thickness automatically decreases as heat flux increases. The thin film configuration reduces the conductive thermal resistance, leads to high frequency bubble departure, and provides separate liquid–vapor pathways, therefore significantly enhances the heat transfer. Our work provides a new nanostructuring approach to achieve ultrahigh heat flux in phase change heat transfer and will benefit both theoretical understanding and application in thermal management of high power devices of boiling heat transfer.