By exploiting the ability of ionic liquids to solubilize molecular sulfur at the melting point, we report the electrodeposition of CuS in an [EMIm]TFSI (1-ethyl-3-methylimidazolium bis (trifluoromethanesulfonyl) imide) electrolytic bath containing Cu(TFSI)2 salt and elemental sulfur. Single-crystal and preferentially oriented covellite CuS thin films with flake morphology have been successfully obtained. Li/CuS coin cells using the deposits after carbon coating as the positive electrode show a discharge capacity of 350 mA h g−1 with capacity retention of 54.4% after 20 cycles.
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Chen et al. (2012) studied this question.
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