Answers are grounded in this paper and cite their sources.
X-ray photoelectron spectroscopy (XPS) and Si K-edge x-ray absorption near-edge spectroscopy (XANES) have been used to characterize 0.5–20 nm thick SiO2 films on Si(100). In XPS measurements, the chemical shift of the Si(-O) 2p peak increases with oxide thickness. However, by neutralizing the surface with low-energy electrons, and using the C 1s as a reference, a chemical shift of 3.9±0.1 eV is found for neutralized oxide films, and the energy difference between the O 1s and Si(-O) 2p is independent of oxide thickness. XANES measurements confirm an invariant chemical shift with oxide thickness, the Si K edge from SiO2 being 1845.50±0.05 eV for all samples. XPS and XANES data then clearly show that any change in chemical shift of the Si(-O) 2p with oxide thickness is mainly due to a surface charging rather than microscopic strain induced by the molar volume mismatch between the oxide and the substrate, as has been previously believed.
No takes yet. Share an insight, caveat, or question.
Yu et al. (1994) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: