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June 28, 2017IEEE Journal of Emerging and Selected Topics in Power Electronics

A Double-End Sourced Wire-Bonded Multichip SiC MOSFET Power Module With Improved Dynamic Current Sharing

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Authors

MWMiao WangFLFang LuoLXLongya Xu

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Wang et al. (2017) studied this question.

synapsesocial.com/papers/6a6ea29575498292b7084f8ehttps://doi.org/10.1109/jestpe.2017.2720731
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