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A method to realize patterned ion-sliced lithium niobate is presented for hybrid photonic integration on silicon. The process involves indirect wafer bonding and dry etching to produce patterns with controllable size, shape, and orientation. The patterns are released by sacrificial wet etching and transferred to silicon waveguides using a pick-and-place process. To demonstrate the technique, a hybrid silicon and lithium niobate racetrack resonator with co-planar electrodes is presented with a measured tunability of 5.2 pm/V. The method enhances flexibility in design and control of fabrication yield for the realization of hybrid silicon and lithium niobate integrated optic devices.
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Chen et al. (2016) studied this question.
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