A method of butt coupling a photodetector chip to the output facet of waveguides by solder bonding is described. The critical step of defining contact pads on the facet that are well aligned to the waveguides is carried out with a temporary shadow mask fabricated in situ. All of the light emerging from the waveguide is collected with little sensitivity to wavelength, polarisation and details of the device structure.
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Chan et al. (1992) studied this question.