The strength of structural adhesive joints for the bonding of metals such as steel or aluminium is mainly reduced by the degradation of the polymer/metal interface due to the ingression of water and subsequent electrochemical reactions. In this work, adhesive/metal interfaces were modified with ultra‐thin adhesion promoting and corrosion resistant bilayer films. A Scanning Kelvin Probe was used for the in‐situ measurement of the interfacial ingression of water and ions as well as for the characterisation of electron transfer processes that lead to a corrosive de‐adhesion.
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Wapner et al. (2004) studied this question.
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