A nanoelectromechanical mass sensor is used to characterize material deposition rates in stencil lithography. The material flux through nanometer-sized apertures is mapped with high spatial (below 1 µm) and deposition-rate (below 10 pm s−1) resolutions by displacing the stencil apertures above the sensor. It is concluded that material flux through apertures as small as 100 nm can be characterized.
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Arcamone et al. (2008) studied this question.
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