On the analysis of physical properties of thermal interfaces based on hexagonal boron nitride and copper

The physical properties (thermal and thermal diffusivity) of thermal interfaces based on powdered boron nitride with a hexagonal crystal lattice (h-BN) and copper with a cubic crystal lattice (Cu) for cooling the electronic component base of micro- and nanoelectronics are studied. The physical properties are determined by the flash method. The prospects of using pressed hexagonal boron nitride powder as a thermal interface without using a binder are described. A comparison with the physical properties of other thermal interfaces that are widely used at present is made.