Adhesion properties between a polycarbonate (PC)/acrylonitrile‐butadiene‐styrene blend substrate and PC films of various thicknesses, bonded through film insert molding, were investigated. The use of various molecular weights of PC and incorporation of PC‐oligomer in the blend substrate has been found to severely affect the adhesion strength and alter the delamination characteristics at the film–substrate interface. Thicker films were able to increase film–substrate adhesion, apart from providing added impact resistance to a brittle substrate. Polym. Eng. Sci. 46:1674–1683, 2006.
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Leong et al. (2006) studied this question.
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