Influence of phonon, geometry, impurity, and grain size on Copper line resistivity

The authors report on the resistivity of submicron copper lines ranging from 75to500nm linewidths as a function of temperature in the 10Kto380K interval. Their estimate of the contributions to electron scattering at 20K for the narrowest line (75nm linewidth) is 29% from copper surfaces, 25% from grain boundaries, and 30% from impurities, with the bulk resistivity making up the remaining 16%. It should be noted that at 300K, the contribution of electron-phonon scattering is about 60% illustrating the benefit of studying different scattering mechanisms at cryogenic temperatures.