In this letter, a concise process technology is proposed for the first time to enable the fabrication of good quality three-dimensional (3-D) suspended radio frequency (RF) micro-inductors on bulk silicon, without utilizing the lithography process on sidewall and trench-bottom patterning. Samples were fabricated to demonstrate the applicability of the proposed process technology.
No takes yet. Share an insight, caveat, or question.
Liang et al. (2002) studied this question.
Synapse has enriched one closely related paper. Consider it for comparative context: