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A simple, semiautomatic single lap apparatus for polishing soft crystalline materials, especially water soluble crystals such as KDP and ADP, has been constructed. Starting with string sawed surfaces, use of this equipment with KDP has produced finished surfaces which are scratch free under at least 1000 × magnification with bright field illumination and 500 × dark field. Total lapping time was about 2 h for removal of a 12–15 μ layer of material. The design and use of the polishing machine and lap are described.
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Ramaswamy et al. (1972) studied this question.
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