Highly Stacked GeSi Nanosheets and Nanowires by Low-Temperature Epitaxy and Wet Etching

The eight stacked Ge0.75Si0.25nanosheets, the seven stacked Ge0.95Si0.05nanowires, and the six stacked Ge0.95Si0.05nanowires without parasitic channels are demonstrated. These highly stacked channels are made from 18 epilayers consisting of a Ge buffer, nine heavily P-doped Ge sacrificial layers, and eight GeSi channel layers with the low growth temperature (350 °C and 375 °C) to ensure the entire epilayers metastable without dislocations in the channels. The isotropic wet etching by H2O2and NH4OH + H2O2is used for the channel release and the removal of the parasitic channels, respectively. The delicate interplay between epilayer design and wet etching is implemented to fabricate the highly stacked GeSi channels. High inter-channel uniformity of the eight stacked Ge0.75Si0.25nanosheets is obtained due to the superior etching selectivity. HighIONper stack and per footprint of the seven stacked Ge0.95Si0.05nanowires and the six stacked Ge0.95Si0.05nanowires without parasitic channels are achieved due to the high mobilityL₄valleys and nanowire conduction. The reduced subthreshold slope (SS) and improvedION / IOFFare obtained by parasitic channel removal. The recordIONof120~ μ Aper stack (4600~ μ A / μ mper channel footprint) atVOV = VDS = 0.5V is reached among reported Ge/GeSi 3-D nFETs.