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We have developed a novel lift-off process for fabrication of high quality superconducting submicron niobium structures. The process makes use of a thermostable polymer with a high transition temperature Tg=235 °C and an excellent chemical stability. The superconducting critical temperature of 150-nm-wide niobium lines is above 7 K. An example of shadow evaporation of a Nb-Cu submicron hybrid structure is given. A potential application of this process is the fabrication of very small single electron devices using refractory metals.
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Dubos et al. (2000) studied this question.
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