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We report here a new dual-coating method for the deposition of SiCOH (elementally descriptive but not representing the stoichiometry) ATMS (allyltrimethylsilane) low- k films on mesoporous SiO ₂ (SBA-15)/PEG (polyethylene glycol) composite films to improve the dielectric constant and mechanical properties of SiCOH/SBA-15 dual forms.
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Park et al. (2014) studied this question.
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