Some techniques for bonding piezoelectric transducers to various materials at cryogenic temperatures are discussed. A number of bond materials are mentioned from the literature, along with a new material, di-2-ethylhexylsebacate (Plexol®). Factors involving the choice of transducer -i.e., expansivtiy, thickness, and finish—are discussed. Experimental data on the mechanical impedance of some of the materials are presented.
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T. B. Bateman (1967) studied this question.