A firm silicate bond between a quartz transducer and the substrate allows bonded transducers to be ground down to a thickness of 10 to 20 μ, achieving fundamental operation up to 300 Mcps. The acoustic bandwidth becomes better than 75% and the insertion loss is less than 30 dB for a one-port delay line model with 190-Mcps center frequency.
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F. Eggers (1963) studied this question.