A novel method is presented for achieving a complete RF front end product equipped with its radiator within a single chip package. This packaging technique provides an alternative solution to problems associated with reduced size antennas implemented on gallium arsenide (GaAs) substrates, such as restoration of the antenna gain by 15 dB. This configuration will help to reduce manufacturing costs associated with connecting the antenna to the RF front-end chip.
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Song et al. (2000) studied this question.
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