Flexibility of Silver Conductive Circuits Screen-Printed on a Polyimide Substrate

The microstructural evolution and mechanical characteristics, especially folding endurance, of screen-printed Ag circuits under various sintering conditions were investigated. The circuits were constructed on a polyimide (PI) film by a screen printing technique using a commercial Ag nanopaste. The sintering temperature and time were raised from 150 to 300 degrees C and from 15 min to 1 hour while the sintering time and temperature were fixed at 30 min and 200 degrees C, respectively. The Massachusetts Institute of Technology (MIT)-type folding endurance tester was used to measure the flexibility of the screen-printed Ag circuits. We observed the change of electrical resistance while the printed Ag patterns were being folded. The folding endurance was better at lower sintering temperature and time, which was explained by the microstructural evolution and macrostructural change of the screen-printed Ag circuits; however, the electrical characteristics were generally poor. Further research is therefore required to improve the electrical and mechanical properties of patterns using direct printing technologies simultaneously.