We demonstrate that the surface roughness of metallorganic chemical vapor deposited is significantly decreased by plasma treatment before the deposition of the film. The root mean square (rms) value of the surface roughness is decreased from by applying plasma for prior to the deposition of an thick layer of . Other plasma gases such as and also decrease the rms value of the surface roughness, but are not as effective as plasma. The decrease of surface roughness is attributed to the enhancement of nucleation density at the initial stages of film growth.
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Sung‐Eon Park (1999) studied this question.