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We demonstrate that the controlled distribution of nanoparticles can be achieved by employing the spin-coating method. The Co and Ag nanoparticles were uniformly distributed on the Si and SiO2 substrates with this method. The particle density was controllable by varying the concentration of colloids. The spatial distribution of the nanoparticles within the patterned area was also shown to be uniform with small boundary effect, which is favorable for current microelectronics technology. We propose that the spin-coating method can be utilized in developing mass production processes for future nanodevices.
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Hong et al. (2002) studied this question.
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