Lead zirconate titanate (PZT) thick films with uniformly dispersed submicrometer pores were successfully fabricated on platinized silicon substrates with various thicknesses ranging from 1 μm to over 100 μm by aerosol deposition. Mixed powders of PZT and polyvinylidene fluoride (PVDF) were deposited for initial fabrication of composite films. After burn‐out of the PVDF phase from the composite films during postannealing processing at 700°C, uniformly dispersed submicrometer pores capable of relaxing the residual stress were generated in the PZT thick films. The dielectric and piezoelectric properties were improved with increasing film thickness due to the minimization of the interfacial clamping effect.
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Han et al. (2011) studied this question.
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