A lithium niobate (LiNbO3)/silicon (Si) hybrid structure has been developed by the surface-activated bonding of LiNbO3 chips with gold (Au) thin film to Si substrates with patterned Au film. After organic contaminants on the Au surfaces were removed using argon radiofrequency plasma, Au-to-Au bonding was carried out in ambient air. Strong bonding at significantly low temperatures below 100◦C without generating cracks has been demonstrated.
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Takigawa et al. (2007) studied this question.
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