Integration of vapor deposited polyimide into a multichip module packaging process

We report the first full integration of a vapor-deposited polyimide dielectric into a multichip module (MCM) electronic packaging scheme. A robust high-throughput vapor deposition polymerization (VDP) of polyimide has been developed for an interconnection scheme in which thin film metal interconnects are patterned from the top of bare die, down the sides, and onto the substrate circuit board surface. VDP polyimides films have been extensively characterized using infrared spectroscopy and prism coupling techniques. The chemical and electrical properties of the VDP polyimide films are similar to commercially available spin cast polyimides.