A three-dimensional anisotropic super micro-etching of crystalline silicon in aqueous KOH is simulated on an atomic level using a new three-dimensional cellular-automata calculational method. The etching simulator ASECA is developed using a rule-based functional Mathematica programming style. The complete program codes and a detailed description of the algorithm are presented.
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Nishidate et al. (1998) studied this question.
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