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The creation of electrical contacts between selected copper rings on a commercial circuit board by a novel method is reported. The method relies on spatially coupled electrodissolution and electrodeposition mediated by an electric field, followed by electroless deposition. The Figure shows an example of a conductive wire formed between two circular rings after the electroless plating step—see also the cover of this issue. magnified image
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Bradley et al. (1997) studied this question.
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