Technical problems associated with the monolithic integration of active circuitry into a high-density microelectrode array for neural recordings include passivation of the active circuit area, capacitive coupling of switching transients, and nonuniformity of the recording surface. These problems can be eliminated by implementing the passive and active elements on opposite planes of a substrate and interconnecting them with transsubstrate conductive channels.
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Kim et al. (1985) studied this question.
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