In Part 2 of this review article, we discuss antenna-on-chip (AoC) solutions for highly integrated millimeter-wave (mm-wave) devices in wireless communications. We also analyze multiple solutions to address the low antenna efficiency of Si substrates, one of the key limitations of AoCs. This is followed by entirely new antenna-in-package (AiP) configurations using glass core substrates for fifth generation (5G) or beyond 5G communications and the unique antenna-on-display (AoD) concept for mobile devices. Finally, we conclude with emerging materials and packaging techniques for future mm-wave applications. In Part 1 of this review article, we discussed multilayer organic and inorganic materials for antenna packaging and its applications. We also introduced AiP-based phased-array systems integrated with radio frequency (RF) transceiver dies.
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Lee et al. (2025) studied this question.
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