Dielectric properties of baked dough samples of various moisture contents, temperatures and densities were measured at 27 MHz with a parallel plate capacitor connected to an Impedance Analyzer (HP 4194A). As a basis for the dielectric prediction model, statistical equations were developed from measurements of the solid density and the solid dielectric properties of flour-water mixtures at various moistures between 2% and 100% moisture. A square root dielectric mixture equation was selected and combined with the regression equations to give modified prediction equations for the dielectric properties of baked dough as functions of moisture content and bulk density at room temperature. These prediction models were further developed by introducing temperature correction terms. These developed models successfully predicted the dielectric properties ofbaked dough at different moisture content, density and high temperature.
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Kim et al. (1998) studied this question.
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