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This paper presents hermetic packaging for MEMS with integrated temperature and pressure sensors based on Silicon On Insulator technology. Temperature and pressure are measured with a single device composed of an aluminium resistor on a suspended silicon membrane. Temperature is determined with the variation of the electrical conductivity of aluminium, whereas the absolute gas pressure measurement is based on the Pirani gauge principle. Design, simulation and experimental characteristics of the sensor confirm the feasibility of this multipurpose sensor approach. The proposed hermetic packaging process enables the electrical contacts to cross the hermetic cavity without need of vias.
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Lefeuvre et al. (2009) studied this question.
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