Examines tensile response in Cu-Be-Co alloy, suggesting heat treatment impacts strength.
This study examines the microstructural evolution and tensile response of a cold-rolled C17200 Cu–Be–Co alloy strip after short-time annealing at 550 and 610 °C. X-ray diffraction (XRD), electron backscatter diffraction (EBSD), kernel average misorientation (KAM) analysis, transmission electron microscopy (TEM), and room-temperature tensile testing were used to compare phase constitution, grain-boundary character, recrystallization behavior, texture evolution, dislocation substructure, and tensile properties. The results show that both annealed samples mainly consisted of an α-Cu matrix and a small amount of BeCu-related precipitates. After annealing at 550 °C, the alloy retained a recovery-dominated partially recrystallized microstructure, with an average grain size of 1.47 μm, a low-angle grain boundary fraction of 8.4%, a recrystallized fraction of 18.06%, and evident residual dislocation substructures. This condition exhibited a yield strength of 365.5 MPa. After annealing at 610 °C, recrystallization was substantially promoted, the average grain size increased to 1.92 μm, the high-angle grain boundary fraction increased to 97.5%, and the recrystallized fraction reached 82.76%. Meanwhile, the yield strength decreased to 276.6 MPa because of the reduced contribution from dislocation strengthening. These results indicate that, under the two investigated short-time annealing conditions, the strength difference in the alloy is mainly associated with the transition of microstructural evolution from recovery-dominated partial recrystallization to a recrystallization-dominated microstructure.
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Wu et al. (2026) studied this question.
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