Fatigue Crack Growth Rates in Adhesive Joints Tested at Different Frequencies

Mode I fatigue crack growth tests were conducted on joints bonded with a filled adhesive (A) at 20 Hz and 2 Hz and on joints bonded with a filled and toughened adhesive (B) at 20 Hz, 2 Hz, 0.2 Hz and 0.02 Hz. Strain energy release rate, G, and J-integral were evaluated based on elastic and elastoplastic finite element analyses (FEA) of the joints bonded with adhesive A and B, respectively. For the configurations considered, J was found to be path-independent and did not differ much from G. The fatigue crack growth rate (FCGR), da/dN, in the joints bonded with adhesive A was relatively independent of frequency while it increased with decreasing frequency at given δ for the joints bonded with adhesive B. The fatigue processes in both adhesives involved the cracking of the filler particles and subsequent linkage of the resultant microcracks. The process zone in adhesive B is larger than that in adhesive A and it increases with decreasing frequency. It is suggested that this variation in process zone size can account for the observed fatigue behaviour. The fatigue crack growth velocity, da/dt, was also calculated for the joints bonded with adhesive B and the variation of da/dt with test frequency at given δG is much smaller than the variation in da/dN, suggesting a creep effect in the fatigue crack growth.