Thermosetting adhesives undergo a chemo‐rheological transition during cure which transforms the material from an initial compliant bonding state to a rigid high strength holding state. The results of combined application of differential scanning calorimetry (DSC) and Instron thermomechanical analysis (TMA) in a study of reaction kinetics and physical state changes in epoxy‐phenolic adhesives are reported. A special reduction of DSC data isolates the apparent heat of polymerization ΔH p and activation energy E* of curing. Analysis of a repetitive extension‐recovery cycle, at low strain amplitude, isolates the temperature‐time effects of curing upon the tensile modulus E, the work of deformation W T = W L + W s , and the work ratio W P /W s = work loss/work stored per cycle. Correlated results of DSC and TMA analysis of two epoxy‐phenolic adhesives isolates the effects of metal fillers upon both the curing kinetics and mechanical response of the cured material.
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Kaelble et al. (1971) studied this question.
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