Heat Transfer Enhancement by Using Copper–Water Nanofluid Flow Inside a Pin Channel

Influences of simultaneous utilization of pin channel and copper–water nanofluid on performance of plate-fin heat exchangers were experimentally explored and compared with results obtained for the base fluid flow inside a plain channel. Experimental results clearly indicate that compared with the plain channel, the pin channel significantly improves the thermal-hydraulic performance of the plate-fin heat exchanger, about 38%. In addition, the heat transfer coefficient as well as pressure drop are increased by using the nanofluids instead of the base fluid. Noticeable average performance factor of 1.65 is obtained for the simultaneous utilization of pin channel and nanofluid inside the plate-fin heat exchanger.