Recent advances in copper-graphene composites: Enhancing thermal conductivity through material engineering

Copper-graphene composites have gained significant attention due to their remarkable thermal conductivity and mechanical properties, making them ideal for advanced heat management applications. This review focuses on the recent developments in copper-graphene composite structures, exploring key factors that influence their thermal conductivity, such as graphene content, interfacial bonding, and fabrication methods. By employing techniques like ball milling, spark plasma sintering, and chemical vapor deposition, researchers have enhanced the thermal and mechanical performance of these composites. The review also highlights the challenges in optimizing graphene dispersion and interfacial bonding, providing insights into future developments for thermal management systems in electronics and other industries.