Answers are grounded in this paper and cite their sources.
The interfacial reactions of Ni, Si/Ni and Ni/Si films on GaAs have been investigated by X-ray photoelectron spectroscopy. In the 450°C-annealed Ni/GaAs system, the interfacial reaction occurred extensively, resulting in formation of the Ni-Ga, Ni-As and Ni-Ga-As compounds. In the annealed Si/Ni/GaAs system, the reaction began at both the Si/Ni and Ni/GaAs interfaces. The Ni silicide formed by intermixing at the Si/Ni interface play a role as a barrier film in preventing out-diffusion of the Ga and As atoms from the Ni/GaAs interface. On the other hand, in the Ni/Si/GaAs system, annealing produced intermixing at the Ni/Si interface but hardly any interfacial reaction at the GaAs substrate.
No takes yet. Share an insight, caveat, or question.
Iwakuro et al. (1990) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: