The fast-paced developments and technological breakthroughs in the semiconductor manufacturing industry elevates the importance of optimum utilization of resources. The newer 300-mm wafers fabs place a high level of emphasis on increasing yield and reducing cycle times. Automated material handling systems are importanttools that help us achieve these objectives. In addition, due to the increased weight and size of 300-mm wafers, an automated material handling system isa must for a 300-mm manufacturing facility. This paper discusses various approaches for automated materials handling in semiconductor manufacturing industries.
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Agrawal et al. (2006) studied this question.
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