Design of a thermally robust O-band heterogeneous laser for CPO: enabling >160  mW output at 380  K

To address the integration limitations of standalone lasers in co-packaged optics (CPO), we present a robust O-band heterogeneous laser design. Leveraging thermal-electro-optical optimization, including an electron stopping layer (ESL), the device overcomes thermal bottlenecks to achieve >160mW on-chip output power at 380 K. The design features a high-tolerance adiabatic taper (>400nm misalignment), ensuring a projected fiber-coupled power exceeding 80 mW under realistic conditions. This work validates the potential of heterogeneous integration to deliver compact, low-cost, and high-power light sources essential for future high-density optical interconnects.