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Electron beam lithography and ion milling have been used to pattern sputtered Cu/Co multilayer wires ranging in width from 750 to 35 nm. Samples having Cu thicknesses which correspond to the first, second, and third antiferromagnetic coupling maxima have been measured. Contrary to expectation, enhancement in the amplitude of the giant magnetoresistance with decreasing width was not observed.
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Katine et al. (1999) studied this question.
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