A new flip-chip bonding method for achieving superconducting electrical contacts has been developed by employing a rapidly solidified Pb-2Sn-0.1Cu-0.5Sb (wt%) alloy wire. The solder balls were made from the wire by means of arc discharge in Ar gas containing H 2 . The bumps were thermosonically fabricated on the Pb-20Sn film deposited on the mullite substrate. Subsequently, a Si chip coated with Nb/Au films was bonded on the substrate using those bumps by means of the thermal compression method. This method has a significant advantage of reducing the elevated temperature for flip-chip bonding to below 100°C.
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Ogashiwa et al. (1992) studied this question.
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