The thermal management is an ever increasing challenge in advanced electronic devices. In this paper, simulation-based optimization is applied to improve the design of a plate-fin heat-sink in terms of operational cost and thermal performance. The proposed framework combines a conjugate heat transfer solver, a CAD engine and an adapted Sandwiching algorithm. A key feature is the use of novel immersed boundary (IB) techniques that allows for automated meshing which is perfectly suited for parametric design optimization.
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Andersson et al. (2018) studied this question.
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