Purpose - The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach - These packages consist of the multi-LEDs and active IC chip such as the application specific IC, LED driver, processor, memory, radio frequency, sensor, or power controller in a 3D manner. The assembly processes of these packages are also presented and discussed. Findings - The advantages of these 3D integration packages are found to be: better performance, lower cost, less footprint, lighter package, and smaller form factor. Originality/value - A thermal management system for 3D IC and LEDs integration packages is proposed.
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Lau et al. (2010) studied this question.
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