Diffusion of silver in copper has been studied in the temperature range 485°c to 625°c using a new sectioning technique. The observed diffusion coefficients are all higher than would be expected from the extrapolation of existing high temperature data, and it has been assumed that this enhancement is due to dislocations providing easy paths for diffusion. The results are interpreted in this paper using the analysis of Hart (1957) as modified by Mortlock (1960) and yield the value 40 000±5000 cal/mole for the activation energy for the diffusion of silver atoms along dislocations in a copper lattice.
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Hugh M. Morrison (1965) studied this question.
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