Thermal, dielectric, and rheological properties of aluminum nitride/liquid crystalline copoly(ester amide) composite for the application of thermal interface materials

In this article, thermally conductive and relatively low dielectric constant polymer matrix composites of an aluminum nitride filler (AlN) and a novel liquid crystalline copoly(ester amide) (LCP) were prepared via a solution blending method in the presence of a phosphate containing dispersant. The viscosities, thermal conductivities, and dielectric properties of the prepared AlN/LCP composites were investigated as a function of AlN loading. Our experimental results demonstrated that the AIN/LCP composite with AlN concentration of 50 wt% had 2.5 times higher thermal conductivity than pure LCP (2.020 and 0.817 W/mK for composite with 50 wt% of AlN and pure LCP, respectively), but its dielectric constant remained at low level, i.e., < 9.0 at frequency of 900 Hz. In addition, viscosities of AlN/LCP pastes in the N ‐methyl‐2‐pyrrolidinone solvent remained at acceptable levels with the high AlN loading of 50 wt%. The morphologies of the prepared composites were also investigated by scanning electron microscopy. POLYM. COMPOS., 2012.