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Low-temperature bonding is an important fabrication technique for advanced microelectronic, MEMS (Micro electro mechanical systems) and optoelectronic devices. Recently, many low-temperature bonding methods such as surface activated bonding have been studied to create unique device structures for a wide range of photonics applications. This paper focuses on low temperature bonding technologies and reviews the state-of-the-art applications in optoelectronic devices.
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Higurashi et al. (2014) studied this question.
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